The third generation of the Gantry Automated Rework Interface (GARI 3.0) is an advanced, automated desoldering machine designed in partnership with Northrop Grumman for the precise removal and replacement of electronic components on printed circuit boards (PCBs). This project aims to fully automate the desoldering process to enhance efficiency, reliability, and repeatability, transforming GARI 3.0 into an industry-effective solution that minimizes manual intervention. GARI 3.0 streamlines the process with full automation, requiring only a touchscreen with a fully functional UI and a joystick for optional manual aiming. The new model utilizes an optically adjustable UV laser for precise, rapid solder melting and a high-power vacuum for safe component removal. It retains the thermal camera and ceramic preheater subsystems for active temperature monitoring and preheating capability respectively. By integrating positional file parsing, an updated mounting system, limit switches, and a 7 inch touchscreen interface, GARI 3.0 autonomously identifies and desolders components, eliminating manual positioning and optimizing efficiency.