Eutectic Die Attach
Electrical Engineering
![Eutectic Logo](/sites/default/files/styles/large/public/2024-05/die.png?itok=64pwLk_y)
Eutectic Die Attach
Tagline
The Power of Precision
Year
2019
Sponsor
Northrup Grumman
Northrop Grumman seeks to find a solution to be able to manually align stacked assembly of a Monolithic Microwave Integrated Circuit (MMIC), solder sheet, and a gold plated heat spreader that are all the size of a grain of rice. Due to the delicate handling that must be used for the MMIC, programming a machine to do this task is risky and could be expensive. Our solution will align the stacked assembly by their centroid through the use of linear sliders. The importance of precise assembling yields a longer lifetime of the devices that the MMICs will be used to power.
Files
ng_euteticdie_poster.pdf2.62 MB