The objective of this capstone project is to develop a Wafer-Based Wireless Thermal Sensor Array—a compact, high-accuracy system designed to mount directly onto a wafer to measure temperature in real-time and wirelessly transmit data to a user-accessible interface. This system addresses a critical challenge in Google Quantum AI’s chip fabrication process, where maintaining strict thermal uniformity is essential. Currently, the hotplate ovens used in fabrication are enclosed within complex machinery and are inaccessible during operation, making real-time monitoring impossible without disassembly and downtime. Our sensor array provides a non-invasive, accurate, and wireless solution to this problem, enabling continuous thermal monitoring and contributing to improved process efficiency and fabrication reliability.